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Microelectronic packaging.
概要
作品:
8 作品在 8 項出版品 8 種語言
書目資訊
Optoelectronic packaging
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(書目-語言資料,印刷品)
Multichip modules : systems advantages major constructionsand
by:
(書目-語言資料,印刷品)
Failure-free integrated circuit packages : systematic elimina
by:
(書目-語言資料,印刷品)
Microvias : for low-cost, high-density interconnects
by:
(書目-語言資料,印刷品)
Fundamentals of microfabrication : the science of miniaturiza
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(書目-語言資料,印刷品)
Introduction to system-on-package (SOP) : miniaturization of
by:
(書目-語言資料,印刷品)
Area array packaging handbook
by:
(書目-語言資料,印刷品)
Advanced Electronic Packaging : With Emphasis On MultichipMod
by:
(書目-語言資料,印刷品)
主題
Optoelectronic devices.
621.3815/2
Ball grid array technology.
TK7836
Integrated optics.
621.3815
Machining.
Microelectronics.
621.3810
TK7874
Lasers
621.381
Multichip modules (Microelectronics)
TK7870.15
Printed circuits.
Electronic packaging.
Microelectronic packaging.
621.381046
Semiconductors
621.381/046
Integrated circuits
Microelectromechanical systems
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