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[NT 60487] Overview
书目信息
主题
Microelectronic packaging.
[NT 60487] Overview
作品:
8 作品在 8 项出版品 8 种语言
书目信息
Optoelectronic packaging
by:
(書目-語言資料)
Multichip modules : systems advantages major constructionsand
by:
(書目-語言資料)
Failure-free integrated circuit packages : systematic elimina
by:
(書目-語言資料)
Microvias : for low-cost, high-density interconnects
by:
(書目-語言資料)
Fundamentals of microfabrication : the science of miniaturiza
by:
(書目-語言資料)
Introduction to system-on-package (SOP) : miniaturization of
by:
(書目-語言資料)
Area array packaging handbook
by:
(書目-語言資料)
Advanced Electronic Packaging : With Emphasis On MultichipMod
by:
(書目-語言資料)
主题
Optoelectronic devices.
621.3815/2
Ball grid array technology.
TK7836
Integrated optics.
621.3815
Machining.
Microelectronics.
621.3810
TK7874
Lasers
621.381
Multichip modules (Microelectronics)
TK7870.15
Printed circuits.
Electronic packaging.
Microelectronic packaging.
621.381046
Semiconductors
621.381/046
Integrated circuits
Microelectromechanical systems
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