Microelectronic packaging.

Overview

Works:	8 works in 8 publications in 8 languages

Titles

Optoelectronic packaging by: (Language materials, printed)

Multichip modules : systems advantages major constructionsand by: (Language materials, printed)

Failure-free integrated circuit packages : systematic elimina by: (Language materials, printed)

Microvias : for low-cost, high-density interconnects by: (Language materials, printed)

Fundamentals of microfabrication : the science of miniaturiza by: (Language materials, printed)

Introduction to system-on-package (SOP) : miniaturization of by: (Language materials, printed)

Area array packaging handbook by: (Language materials, printed)

Advanced Electronic Packaging : With Emphasis On MultichipMod by: (Language materials, printed)

Subjects

TK7836

621.3815

621.3810

TK7874

Lasers

621.381

TK7870.15