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Titles
Subjects
Electronic packaging.
Overview
Works:
2 works in 2 publications in 2 languages
Titles
Semiconductor packaging : a multidisciplinary approach
by:
(Language materials, printed)
Multichip modules : systems advantages major constructionsand
by:
(Language materials, printed)
Subjects
621.381
Multichip modules (Microelectronics)
TK7870.15
Electronic packaging.
tegrated circuits
Microelectronic packaging.
621.381046
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