建國科技大學圖書館 |

語系: 繁體中文

說明(常見問題)

圖書館個人資料蒐集告知聲明

登入

回首頁

切換: 標籤 | MARC模式 | ISBD

Characterization of integrated circu...

McKenna, Robert G.

Characterization of integrated circuit packaging materials

紀錄類型:	書目-語言資料,印刷品 : 單行本
其他作者:	McKennaRobert G.,
其他作者:	MooreThomas M.,
出版地:	New York
出版者:	Momentum Press;
出版年:	2010
面頁冊數:	xx, 274 p.ill. : 24 cm.;
集叢名:	Materials characterization series
標題:	Electronic packaging - Materials -
標題:	Integrated circuits - Design and construction -
附註:	Includes bibliographical references and index
摘要註:	Characterization of Integrated Circuit Packaging Materials deals with the systems of materials that comprise IC packages. Chapters in this volume address important characteristics of IC packages. It demonstrates analytical techniques appropriate for IC package characterization through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. This book discusses issues which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board, and multi-chip models
ISBN:	978-1-60650-187-0
內容註:	IC Package Reliability Testing Mold Compound Adhesion and Strength Mechanical Stress in IC Packages Moisture Sensitivity and Delamination Thermal Management Electrical Performance of IC Packages Solderability of Integrated Circuits Hermeticity and Joining in Ceramic IC Packages Advanced Interconnect Technology Appendix: Technique Summaries

Characterization of integrated circuit packaging materials
Characterization of integrated circuit packaging materials / editors, Thomas M. Moore and Robert G. McKenna - New York : Momentum Press, 2010. - xx, 274 p. ; ill. ; 24 cm.. - (Materials characterization series).
IC Package Reliability Testing.
Includes bibliographical references and indexReissued volume first published by Butterworth-Heinemann in 1993.
ISBN 978-1-60650-187-0ISBN 978-1-60650-189-4ISBN 1-60650-187-9ISBN 1-60650-189-5
Electronic packagingIntegrated circuits -- Materials -- Design and construction

McKenna, Robert G.

Characterization of integrated circuit packaging materials
LDR:01794cam0 2200253 i 450 001 321559
009 9781606501870
010 1 $a 978-1-60650-187-0 $b hbk. $d NT2664
010 1 $a 978-1-60650-189-4 $b ebook
010 1 $a 1-60650-187-9 $b hbk.
010 1 $a 1-60650-189-5 $b ebook
100 $a 20121006d2010 m y0engy50 ba
101 0 $a eng
102 $a us
105 $a a a 001zy
200 1 $a Characterization of integrated circuit packaging materials $f editors, Thomas M. Moore and Robert G. McKenna
210 $a New York $c Momentum Press $d 2010
215 1 $a xx, 274 p. $c ill. $d 24 cm.
225 1 $a Materials characterization series
300 $a Includes bibliographical references and index
300 $a Reissued volume first published by Butterworth-Heinemann in 1993
327 0 $a IC Package Reliability Testing $a Mold Compound Adhesion and Strength $a Mechanical Stress in IC Packages $a Moisture Sensitivity and Delamination $a Thermal Management $a Electrical Performance of IC Packages $a Solderability of Integrated Circuits $a Hermeticity and Joining in Ceramic IC Packages $a Advanced Interconnect Technology $a Appendix: Technique Summaries
330 $a Characterization of Integrated Circuit Packaging Materials deals with the systems of materials that comprise IC packages. Chapters in this volume address important characteristics of IC packages. It demonstrates analytical techniques appropriate for IC package characterization through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. This book discusses issues which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board, and multi-chip models
606 $a Electronic packaging $x Materials $2 lc $3 274701
606 $a Integrated circuits $x Design and construction $2 lc $3 72853
676 $a 621.381/046 $v 20
680 $a TK7870.15 $b .C52 2010
702 1 $a McKenna $b Robert G. $3 274699
702 1 $a Moore $b Thomas M. $3 274700