語系:
繁體中文
English
簡体中文
說明(常見問題)
圖書館個人資料蒐集告知聲明
登入
回首頁
切換:
標籤
|
MARC模式
|
ISBD
Thermal design : heat sinks, thermoe...
~
Lee, Ho Sung
Thermal design : heat sinks, thermoelectrics, heat pipes, compact heat exchangers, ands solar cells
紀錄類型:
書目-語言資料,印刷品 : 單行本
副題名:
heat sinks, thermoelectrics, heat pipes, compact heat exchangers, ands solar cells
作者:
LeeHo Sung,
出版地:
Hoboken, NJ
出版者:
Wiley;
出版年:
c2010
面頁冊數:
xviii, 630 p.ill. : 25 cm.;
標題:
Heat engineering - Materials -
標題:
Heat-transfer media -
標題:
Thermodynamics -
標題:
Thermoelectric apparatus and appliances -
附註:
Includes bibliographical references and index
摘要註:
"The proposed is written as a senior undergraduate or the first-year graduate textbook,covering modern thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space, etc. However, there is no textbook available covering this range of topics. The proposed book may be used as a capstone design course after the fundamental courses such as thermodynamics, fluid mechanics, and heat transfer. The underlying concepts in this book cover the, 1) understanding of the physical mechanisms of the thermal devices with the essential formulas and detailed derivations, and 2) designing the thermal devices in conjunction with mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Important design examples are developed using the commercial software, MathCAD, which allows the students to easily reach the graphical solutions even with highly detailed processes. In other words, the design concept is embodied through the example problems. The graphical presentation generally provides designers or students with the rich and flexible solutions toward achieving the optimal design. A solutions manual will be provided"--Provided by publisher
ISBN:
978-0-470-49662-6
Thermal design : heat sinks, thermoelectrics, heat pipes, compact heat exchangers, ands solar cells
Lee, Ho Sung
Thermal design
: heat sinks, thermoelectrics, heat pipes, compact heat exchangers, ands solar cells / HoSung Lee - Hoboken, NJ : Wiley, c2010. - xviii, 630 p. ; ill. ; 25 cm..
Includes bibliographical references and index.
ISBN 978-0-470-49662-6ISBN 978-0-470-94997-9ISBN 978-0-470-95160-6ISBN 978-0-470-95177-4ISBN 978-1-118-00468-5ISBN 978-111-8-00470-8ISBN 978-111-8-00471-5ISBN 0-470-49662-2ISBN 0-470-94997-XISBN 0-470-95160-5ISBN 0-470-95177-XISBN 1-118-00468-XISBN 111-8-00470-1ISBN 111-8-00471-X
Heat engineeringHeat-transfer mediaThermodynamicsThermoelectric apparatus and appliances -- Materials
Thermal design : heat sinks, thermoelectrics, heat pipes, compact heat exchangers, ands solar cells
LDR
:02615cam0 2200361 i 450
001
321458
005
20110615092658.0
009
2010018381
010
1
$a
978-0-470-49662-6
$b
hbk.
$d
NT4441
010
1
$a
978-0-470-94997-9
$b
ebk.
010
1
$a
978-0-470-95160-6
$b
ebk.
010
1
$a
978-0-470-95177-4
$b
ebk.
010
1
$a
978-1-118-00468-5
$b
ebk.
010
1
$a
978-111-8-00470-8
$b
ebk.
010
1
$a
978-111-8-00471-5
$b
ebk.
010
1
$a
0-470-49662-2
$b
hbk.
010
1
$a
0-470-94997-X
$b
ebk.
010
1
$a
0-470-95160-5
$b
ebk.
010
1
$a
0-470-95177-X
$b
ebk.
010
1
$a
1-118-00468-X
$b
ebk.
010
1
$a
111-8-00470-1
$b
ebk.
010
1
$a
111-8-00471-X
$b
ebk.
020
$a
us
$b
2010018381
100
$a
20121006d2010 m y0engy50 ba
101
0
$a
eng
102
$a
us
105
$a
a a 001zy
200
1
$a
Thermal design
$e
heat sinks, thermoelectrics, heat pipes, compact heat exchangers, ands solar cells
$f
HoSung Lee
210
$a
Hoboken, NJ
$c
Wiley
$d
c2010
215
1
$a
xviii, 630 p.
$c
ill.
$d
25 cm.
300
$a
Includes bibliographical references and index
330
$a
"The proposed is written as a senior undergraduate or the first-year graduate textbook,covering modern thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space, etc. However, there is no textbook available covering this range of topics. The proposed book may be used as a capstone design course after the fundamental courses such as thermodynamics, fluid mechanics, and heat transfer. The underlying concepts in this book cover the, 1) understanding of the physical mechanisms of the thermal devices with the essential formulas and detailed derivations, and 2) designing the thermal devices in conjunction with mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Important design examples are developed using the commercial software, MathCAD, which allows the students to easily reach the graphical solutions even with highly detailed processes. In other words, the design concept is embodied through the example problems. The graphical presentation generally provides designers or students with the rich and flexible solutions toward achieving the optimal design. A solutions manual will be provided"--Provided by publisher
606
$a
Heat engineering
$x
Materials
$2
lc
$3
274379
606
$a
Heat-transfer media
$2
lc
$3
274380
606
$a
Thermodynamics
$2
lc
$3
55494
606
$a
Thermoelectric apparatus and appliances
$2
lc
$3
274381
676
$a
621.402/5
$v
22
680
$a
TJ255.5
$b
.L44 2010
700
1
$a
Lee
$b
Ho Sung
$3
274378
筆 0 讀者評論
館藏地:
全部
六樓西文書庫區
出版年:
卷號:
館藏
期刊年代月份卷期操作說明(Help)
1 筆 • 頁數 1 •
1
條碼號
典藏地名稱
館藏流通類別
資料類型
索書號
使用類型
借閱狀態
預約人數
期刊出刊日期 / 原館藏地 / 其他備註
附件
317047
六樓西文書庫區
圖書流通(BOOK_CIR)
BOOK
621.4025/L478
一般使用(Normal)
書架上
0
1 筆 • 頁數 1 •
1
評論
新增評論
分享你的心得
建立或儲存個人書籤
書目轉出
取書館別
處理中
...
變更密碼
登入