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Characterization of integrated circu...

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McKenna, Robert G.

Characterization of integrated circuit packaging materials

紀錄類型:	書目-語言資料,印刷品 : 單行本
其他作者:	McKennaRobert G.,
其他作者:	MooreThomas M.,
出版地:	New York, NY
出版者:	Momentum Press;
出版年:	2010.
面頁冊數:	xx, 274 p.ill. : 24 cm.;
集叢名:	Materials characterization series
標題:	Electronic packaging - Materials. -
標題:	Integrated circuits - Design and construction. -
附註:	"First published by Butterworth-Heinemann in 1993...Reissued volume published in 2010 by Momentum Press"--T.p. verso.
ISBN:	1-60650-187-9

Characterization of integrated circuit packaging materials
Characterization of integrated circuit packaging materials / editors, Thomas M. Moore and Robert G. McKenna. - New York, NY : Momentum Press, 2010.. - xx, 274 p. ; ill. ; 24 cm.. - (Materials characterization series).
"First published by Butterworth-Heinemann in 1993...Reissued volume published in 2010 by Momentum Press"--T.p. verso..
Includes bibliographical references and index..
ISBN 1-60650-187-9ISBN 1-60650-189-5ISBN 978-1-60650-187-0ISBN 978-1-60650-189-4
Electronic packagingIntegrated circuits -- Materials. -- Design and construction.

McKenna, Robert G.

Characterization of integrated circuit packaging materials
LDR:00897nam2 2200241 4500 001 312541
005 111112153050.0
009 26146
010 1 $a 1-60650-187-9
010 1 $a 1-60650-189-5 $b ebk.
010 1 $a 978-1-60650-187-0 $d NT2368
010 1 $a 978-1-60650-189-4 $b ebk.
100 $a 20111123d2010 m y0engy01 b
101 0 $a eng
105 $a a a 001yy
200 1 $a Characterization of integrated circuit packaging materials $f editors, Thomas M. Moore and Robert G. McKenna.
210 $a New York, NY $c Momentum Press $d 2010.
215 1 $a xx, 274 p. $c ill. $d 24 cm.
225 2 $a Materials characterization series
300 $a "First published by Butterworth-Heinemann in 1993...Reissued volume published in 2010 by Momentum Press"--T.p. verso.
320 $a Includes bibliographical references and index.
410 0 $1 2001 $a Materials characterization series
606 $a Electronic packaging $x Materials. $2 lc $3 278329
606 $a Integrated circuits $x Design and construction. $2 lc $3 39289
676 $a 621.381046 $b C469
702 1 $a McKenna $b Robert G. $3 274699
702 1 $a Moore $b Thomas M. $3 274700
801 0 $a cw $c 20111116 $g CCR

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