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Characterization of integrated circu...
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McKenna, Robert G.
Characterization of integrated circuit packaging materials
紀錄類型:
書目-語言資料,印刷品 : 單行本
其他作者:
McKennaRobert G.,
其他作者:
MooreThomas M.,
出版地:
New York, NY
出版者:
Momentum Press;
出版年:
2010.
面頁冊數:
xx, 274 p.ill. : 24 cm.;
集叢名:
Materials characterization series
標題:
Electronic packaging - Materials. -
標題:
Integrated circuits - Design and construction. -
附註:
"First published by Butterworth-Heinemann in 1993...Reissued volume published in 2010 by Momentum Press"--T.p. verso.
ISBN:
1-60650-187-9
Characterization of integrated circuit packaging materials
Characterization of integrated circuit packaging materials
/ editors, Thomas M. Moore and Robert G. McKenna. - New York, NY : Momentum Press, 2010.. - xx, 274 p. ; ill. ; 24 cm.. - (Materials characterization series).
"First published by Butterworth-Heinemann in 1993...Reissued volume published in 2010 by Momentum Press"--T.p. verso..
Includes bibliographical references and index..
ISBN 1-60650-187-9ISBN 1-60650-189-5ISBN 978-1-60650-187-0ISBN 978-1-60650-189-4
Electronic packagingIntegrated circuits -- Materials. -- Design and construction.
McKenna, Robert G.
Characterization of integrated circuit packaging materials
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