建國科技大學圖書館 |

語系: 繁體中文

說明(常見問題)

圖書館個人資料蒐集告知聲明

登入

回首頁

切換: 標籤 | MARC模式 | ISBD

Integrated Circuit, Hybrid, And Mult...

~

Pech, t, Michael

Integrated Circuit, Hybrid, And Multichip Module Package D

紀錄類型:	書目-語言資料,印刷品 : 單行本
作者:	Pecht, Michael,
出版地:	New York
出版者:	John Wiley & Sons, Inc.;
出版年:	c.1994
面頁冊數:	xxxi,426p.ill.,form : 24cm.;
標題:	Electronic Packaging－Design. -
標題:	Hybrid Integrated Circuits－Design And Constructio -
標題:	Multichip Modules(Mocroelectronics)－Design And C -
附註:	Includes bibliographical re- ferences and index.
ISBN:	0-471-59446-6

Integrated Circuit, Hybrid, And Multichip Module Package D
Pech, t, Michael

Integrated Circuit, Hybrid, And Multichip Module Package D = : / ; - New York : John Wiley & Sons, Inc., c.1994. - xxxi,426p. ; ill.,form ; 24cm..
Includes bibliographical re- ferences and index..
ISBN 0-471-59446-6
Electronic Packaging－Design.Hybrid Integrated Circuits－Design And ConstructioMultichip Modules(Mocroelectronics)－Design And C

Integrated Circuit, Hybrid, And Multichip Module Package D
LDR:00552cam2 2200169 050 001 211395
005 20100521132556.0
009 00055632
010 1 $a 0-471-59446-6 $b bound $d NT$880
100 $a 20100529d y0 y09 e
101 0 $a eng
200 1 $a Integrated Circuit, Hybrid, And Multichip Module Package D $d $e $f $g
205 $s ign Guidelines $e A Focus On Reliabilit $f Michael Pecht
210 $a New York $c John Wiley & Sons, Inc. $d c.1994
215 1 $a xxxi,426p. $c ill.,form $d 24cm.
300 $a Includes bibliographical re- ferences and index.
606 $a Electronic Packaging－Design. $3 222094
606 $a Hybrid Integrated Circuits－Design And Constructio $3 222095
606 $a Multichip Modules(Mocroelectronics)－Design And C $3 222096
681 $a 621.381 $b P365
700 1 $a Pech $b t, Michael $3 222093
801 0 $a cw $c 19970315 $g CCR

筆 0 讀者評論

館藏地: 出版年: 卷號:

館藏

期刊年代月份卷期操作說明(Help)

1 筆 • 頁數 1 •
1

典藏地名稱

館藏流通類別

期刊出刊日期 / 原館藏地 / 其他備註

845566

B2密集書庫2

圖書流通(BOOK_CIR)

BOOK

621.381/P365

一般使用(Normal)

書架上

0

B2密集二

1 筆 • 頁數 1 •
1

評論

新增評論分享你的心得

建立或儲存個人書籤

書目轉出

取書館別

變更密碼

登入